Din 60352-2 [hot] Here

| Standard | Scope | | --- | --- | | | Press-in technology for PCBs (most detailed on hole & pin interaction) | | IEC 60352-5 | General press-in connections (less PCB-specific) | | IPC-9797 | Press-fit standard for high-reliability applications (U.S.-centric) | | DIN 60352-1 | Wrapping connections (not press-in) |

The standard emphasizes humidity and temperature exposure. A crimped connection is often tested under damp heat (cyclic or steady-state) to ensure that the gas-tight interface does not corrode, which would increase resistance and create a fire hazard. din 60352-2

As electronics move toward (EVs, e-mobility) and higher temperatures (SiC, GaN devices), press-in offers a solder-free path. New developments include: | Standard | Scope | | --- |

The standard is the German implementation of the international IEC 60352-2 , which specifies the essential requirements, test methods, and practical guidance for solderless crimped connections. This standard ensures that electrical and electronic equipment interconnections are mechanically reliable and electrically stable under various environmental conditions. Scope and Applicability New developments include: The standard is the German